Copper Alloy C10200

General Characteristics
C10200 is an oxygen-free copper, which is used mainly in electronics due to high electrical conductivity. This high purity alloy (99.95 Cu+Ag) is produced without the use of metal or metalloid deoxidizers. Excessive amounts of impurities reduce conductivity. This alloy has excellent resistance to atmospheric corrosion and can be fabricated by a variety of hot and cold methods. Typical applications: busbars, bus conductors, waveguides, hollow conductors, lead-in wires and anodes for vacuum tubes, vacuum seals, transistor components, glass to metal seals, coaxial cables, klystrons, microwave tubes and rectifiers.
Typical Chemical Composition

Weight % Cu + Ag Other

minimum — —

maximum 99.95 0.05

Weight %	Cu + Ag	Other
minimum	—	—
maximum	99.95	0.05

Characteristics		English		Metric
Nominal density (68°F/20°C)		0.323 lbs/in³		8.94 g/cm³
Specific heat (212 °F/100°C)		0.092 BTU/lb – °F		385 J/KG- °K
Coefficient of thermal expansion	68°F – 212°F 20°C – 100°C	9.4 micro in/in- °F		17.0 micro m/m- °K
	68°F – 392°F 20°C – 200°C	9.6 micro in/in- °F		17.3 micro m/m- °K
	68°F – 572°F 20°C – 300°C	9.8 micro in/in- °F		17.7 micro m/m- °K
Thermal conductivity	20°C / 68°F	226 BTU/ft- hr – °F	391 W/m – °K
Electrical resistivity	20°C / 68°F	17.1 nΩ ∙ m
Electrical conductivity	20°C / 68°F	101% IACS

Temper		Tensile					Hardness	Shear		Fatigue
		Ultimate		Yield		Elongation in 50 mm (2 in.)	Rockwell B	Shear strength		Fatigue strength
		KSI	MPa	KSI	MPa	%		KSI	MPa	KSI	MPa
H80 – Hard Drawn	6 mm (0.25 in.) diameter + 40% C.W.	55	380	50	345	10	80	29	200	—	—
	25 mm (1 in.) diameter + 35% C.W.	48	330	44	305	16	47	27	185	17	115
	50 mm (2 in.) diameter + 16% C.W.	45	310	40	275	20	45	26	180	—	—
OSO50 – average grain size 0.05 mm or M20 – As rolled condition	25 mm (1 in.) diameter	32	220	10	69	55 (70% reduction of area)	—	22	150	—	—

Copper Alloy C10200 Sales:+972 4 618 2000

General Characteristics
C10200 is an oxygen-free copper, which is used mainly in electronics due to high electrical conductivity. This high purity alloy (99.95 Cu+Ag) is produced without the use of metal or metalloid deoxidizers. Excessive amounts of impurities reduce conductivity. This alloy has excellent resistance to atmospheric corrosion and can be fabricated by a variety of hot and cold methods. Typical applications: busbars, bus conductors, waveguides, hollow conductors, lead-in wires and anodes for vacuum tubes, vacuum seals, transistor components, glass to metal seals, coaxial cables, klystrons, microwave tubes and rectifiers.
Typical Chemical Composition

Weight % Cu + Ag Other

minimum — —

maximum 99.95 0.05

Weight %	Cu + Ag	Other
minimum	—	—
maximum	99.95	0.05

Characteristics		English		Metric
Nominal density (68°F/20°C)		0.323 lbs/in³		8.94 g/cm³
Specific heat (212 °F/100°C)		0.092 BTU/lb – °F		385 J/KG- °K
Coefficient of thermal expansion	68°F – 212°F 20°C – 100°C	9.4 micro in/in- °F		17.0 micro m/m- °K
	68°F – 392°F 20°C – 200°C	9.6 micro in/in- °F		17.3 micro m/m- °K
	68°F – 572°F 20°C – 300°C	9.8 micro in/in- °F		17.7 micro m/m- °K
Thermal conductivity	20°C / 68°F	226 BTU/ft- hr – °F	391 W/m – °K
Electrical resistivity	20°C / 68°F	17.1 nΩ ∙ m
Electrical conductivity	20°C / 68°F	101% IACS

Temper		Tensile					Hardness	Shear		Fatigue
		Ultimate		Yield		Elongation in 50 mm (2 in.)	Rockwell B	Shear strength		Fatigue strength
		KSI	MPa	KSI	MPa	%		KSI	MPa	KSI	MPa
H80 – Hard Drawn	6 mm (0.25 in.) diameter + 40% C.W.	55	380	50	345	10	80	29	200	—	—
	25 mm (1 in.) diameter + 35% C.W.	48	330	44	305	16	47	27	185	17	115
	50 mm (2 in.) diameter + 16% C.W.	45	310	40	275	20	45	26	180	—	—
OSO50 – average grain size 0.05 mm or M20 – As rolled condition	25 mm (1 in.) diameter	32	220	10	69	55 (70% reduction of area)	—	22	150	—	—