C10200 is an oxygen-free copper, which is used mainly in electronics due to high electrical conductivity. This high purity alloy (99.95 Cu+Ag) is produced without the use of metal or metalloid deoxidizers. Excessive amounts of impurities reduce conductivity. This alloy has excellent resistance to atmospheric corrosion and can be fabricated by a variety of hot and cold methods. Typical applications: busbars, bus conductors, waveguides, hollow conductors, lead-in wires and anodes for vacuum tubes, vacuum seals, transistor components, glass to metal seals, coaxial cables, klystrons, microwave tubes and rectifiers.
Weight % | Cu + Ag | Other |
---|---|---|
minimum | — | — |
maximum | 99.95 | 0.05 |
Characteristics | English | Metric | ||
---|---|---|---|---|
Nominal density
(68°F/20°C) |
0.323 lbs/in3 | 8.94 g/cm3 | ||
Specific heat
(212 °F/100°C) |
0.092 BTU/lb – °F | 385 J/KG- °K | ||
Coefficient of thermal
expansion |
68°F – 212°F
20°C – 100°C |
9.4 micro in/in- °F | 17.0 micro m/m- °K | |
68°F – 392°F
20°C – 200°C |
9.6 micro in/in- °F | 17.3 micro m/m- °K | ||
68°F – 572°F
20°C – 300°C |
9.8 micro in/in- °F | 17.7 micro m/m- °K | ||
Thermal conductivity
|
20°C / 68°F | 226 BTU/ft- hr – °F | 391 W/m – °K | |
Electrical resistivity | 20°C / 68°F | 17.1 nΩ ∙ m | ||
Electrical conductivity | 20°C / 68°F | 101% IACS |
Temper | Tensile | Hardness | Shear | ||||||
---|---|---|---|---|---|---|---|---|---|
Ultimate | Yield | Elongation
in 50 mm (2 in.) |
Rockwell F | Shear
strength |
|||||
KSI | MPa | KSI | MPa | % | KSI | MPa | |||
OSO25 –
Average grain size 0.025 mm |
25 mm
(1 in.) outside diameter, 1.65 mm (0.065 in.) wall thickness |
34 | 235 | 11 | 76 | 45 | 45 | 23 | 160 |
OSO50 –
Average grain size 0.050 mm |
32 | 220 | 10 | 69 | 45 | 40 | 22 | 150 | |
H55 –
Light drawn, light cold rolled (15% C.W.) |
40 | 275 | 220 | 32 | 25 | 77 | 26 | 180 | |
H80 –
Hard drawn (40% C.W.) |
55 | 380 | 50 | 345 | 8 | 95 | 29 | 200 |