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C10200 is an oxygen-free copper, which is used mainly in electronics due to high electrical conductivity. This high purity alloy (99.95 Cu+Ag) is produced without the use of metal or metalloid deoxidizers. Excessive amounts of impurities reduce conductivity. This alloy has excellent resistance to atmospheric corrosion and can be fabricated by a variety of hot and cold methods. Typical applications: busbars, bus conductors, waveguides, hollow conductors, lead-in wires and anodes for vacuum tubes, vacuum seals, transistor components, glass to metal seals, coaxial cables, klystrons, microwave tubes and rectifiers.
| Weight % | Cu + Ag | Other |
|---|---|---|
| minimum | — | — |
| maximum | 99.95 | 0.05 |
| Characteristics | English | Metric | ||
|---|---|---|---|---|
| Nominal density
(68°F/20°C) |
0.323 lbs/in3 | 8.94 g/cm3 | ||
| Specific heat
(212 °F/100°C) |
0.092 BTU/lb – °F | 385 J/KG- °K | ||
| Coefficient of thermal
expansion |
68°F – 212°F
20°C – 100°C |
9.4 micro in/in- °F | 17.0 micro m/m- °K | |
| 68°F – 392°F
20°C – 200°C |
9.6 micro in/in- °F | 17.3 micro m/m- °K | ||
| 68°F – 572°F
20°C – 300°C |
9.8 micro in/in- °F | 17.7 micro m/m- °K | ||
| Thermal conductivity
|
20°C / 68°F | 226 BTU/ft- hr – °F | 391 W/m – °K | |
| Electrical resistivity | 20°C / 68°F | 17.1 nΩ ∙ m | ||
| Electrical conductivity | 20°C / 68°F | 101% IACS | ||
| Temper | Tensile | Hardness | Shear | Fatigue | |||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Ultimate | Yield | Elongation | Rockwell F | Shear
strength |
Fatigue strength | ||||||
| KSI | MPa | KSI | MPa | % | KSI | MPa | KSI | MPa | |||
| OSO50 – average
grain size 0.05 mm |
2 mm
(0.08 in.) diameter |
35 | 240 | — | — | 35
(in 254 mm – 10 in.) |
45 | 24 | 165 | — | — |
| H04 – Hard | 55 | 380 | — | — | 1.5
(in 1500 mm – 60 in.) |
— | 29 | 200 | — | — | |
| H08 – Spring | 66 | 455 | — | — | 1.5
(in 1500 mm – 60 in.) |
— | 33 | 230 | — | — | |
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