Copper Alloy C10200

  • Copper Alloy C10200
  • General Characteristics

    C10200 is an oxygen-free copper, which is used mainly in electronics due to high electrical conductivity. This high purity alloy (99.95 Cu+Ag) is produced without the use of metal or metalloid deoxidizers. Excessive amounts of impurities reduce conductivity. This alloy has excellent resistance to atmospheric corrosion and can be fabricated by a variety of hot and cold methods. Typical applications: busbars, bus conductors, waveguides, hollow conductors, lead-in wires and anodes for vacuum tubes, vacuum seals, transistor components, glass to metal seals, coaxial cables, klystrons, microwave tubes and rectifiers.

  • Typical Chemical Composition

    Weight % Cu + Ag Other
    minimum
    maximum 99.95 0.05
  • Physical Properties

    Characteristics English Metric
    Nominal density

    (68°F/20°C)

    0.323 lbs/in3 8.94 g/cm3
    Specific heat

    (212 °F/100°C)

    0.092 BTU/lb – °F 385 J/KG- °K
    Coefficient of thermal

    expansion

    68°F – 212°F

    20°C – 100°C

    9.4 micro in/in- °F 17.0 micro m/m- °K
    68°F – 392°F

    20°C – 200°C

    9.6 micro in/in- °F 17.3 micro m/m- °K
    68°F – 572°F

    20°C – 300°C

    9.8 micro in/in- °F 17.7 micro m/m- °K
    Thermal conductivity

     

    20°C   /   68°F 226 BTU/ft- hr – °F 391 W/m – °K
    Electrical resistivity 20°C   /   68°F 17.1 nΩ ∙ m
    Electrical conductivity 20°C   /   68°F 101% IACS
  • Mechanical Properties

    Temper Tensile Hardness Shear Fatigue
    Ultimate Yield Elongation

    in 50 mm

    (2 in.)

    Rockwell F Shear strength Fatigue strength
    KSI MPa KSI MPa % KSI MPa KSI MPa
    M20 – Hot rolled 1 mm

    (0.04 in.) thick

    34 235 10 69 45 45 23 160
    OSO25 – 0.025 Grain size 34 235 11 76 45 45 23 160 11 76
    OSO50 – 0.05

    Grain size

    32 220 10 69 45 40 22 150
    H00 – ⅛ Hard 36 250 28 195 30 60 25 170
    H01 – ¼ Hard 38 260 30 205 25 70 25 170
    H02 – ½ Hard 42 290 36 250 14 84 26 180 13 90
    H04 – Hard 50 345 45 310 6 90 28 195 13 90
    H08 – Spring 55 380 50 345 4 94 29 200 14 95
    H10 – Extra Spring 57 395 50 345 4 95 29 200
    M20 – Hot rolled

    Or

    OSO50 – 0.05

    Grain size

    6 mm

    (0.25 in.) thick

    32 220 10 69 50 40 22 150
    H00 – ⅛ Hard 36 250 28 195 40 60 25 170
    H01 – ¼ Hard 38 260 30 205 35 70 25 170
    H04 – Hard 50 345 45 310 12 90 28 195
    H04 – Hard 25 mm

    (1 in.) thick

    45 310 40 275 20 85 26 180
  • Specifications

    • AMS – QQ-C-576
    • ASTM – B48, B133, B152, B187, B272, B370, B432, B451

View full Quality Metals catalogue

BROWSE CATALOGUE

BTI is proud to be the exclusive representative of in Israel, the leading company for Modular Profile solutions and related products

Skip to content